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従って，セキュリティ対策は半導体製造装置の不可避な要件となっている。
SEMI E5-0712 (technical revision)
2-1016 (Reapproved 0224)
NOTE 1: Although no limits are imposed on extractable contaminants from resin pellets by this Specification
the Standard describes a validation process to identify and address real implementation issues as early as possible
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Revision:SEMI G15-93 - Superseded 従って，セキュリティ対策は半導体製造装置の不可避な要件となっている。NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History